Job Information
Siemens Digital Industries Software 3D IC Solutions Engineer- Thermal/Stress Engineer in Wilsonville, Oregon
Job Family: Research & Development
Req ID: 420882
Siemens EDA is a global technology leader in electronic design automation software. Our software tools enable companies around the world to develop new and highly innovative electronic products faster and more cost-effectively. Our customers use our tools to push the boundaries of technology and physics in order to deliver better products in the increasingly complex world of chip, board and system design.
Job Overview
Siemens EDA is seeking a senior level, self-starting, motivated, and hard-working individual for an opportunity to serve as a senior thermal/stress analysis lead in our 3D IC Solutions Engineering team in driving the development of comprehensive, end to end workflow solutions supporting the development of advanced 2.5 and 3D System in Package (SIP) designs. These multi-domain workflow solutions seamlessly integrate Siemens’ industry leading EDA and MCAD tools that facilitate the architectural planning, physical design/verification, muti-die based electrical, thermal, mechanical stress analysis and manufacturing test of advanced 2.5 and 3D System-in-Package (SIP) designs.
The primary responsibility for this position is in developing workflows and methodologies to support the thermal and thermal-mechanical stress analysis of 2.5/3D IC package designs. This analysis leverages several Siemens thermal and stress/reliability analysis tools and requires the identification of potentially new tools and methods to develop a best in class toolkit.. These workflows will support predictive analysis during the architectural planning and analysis phase, in-design analysis during the physical design phase and signoff to manufacturing handoff analysis. Additional support for mechanical tolerance and sensitivity analysis is also offer for design that include custom mechanical package/lid/stiffener designs and/or thermal heat sink designs. The thermal and stress analysis workflows will also include support for true 3D stacked die designs.
Reference designs and test structures and/or customer designs will be used in the development, testing and validation of these workflows. The thermal/stress analysis lead will work closely with potential customers and academic knowledge hubs. Their responsibilities will include gathering requirements from existing and potential customers / partners and communicate these to the respective product management organizations within Siemens DISW. The ideal candidate will have the ability to work horizontally in the organization and influence multiple product management/product development teams without direct authority. The thermal/stress lead will also provide technical support and guidance to the sales, marketing design service organizations as required.
This position may require periodic travel to work with customers in developing and validating these workflow solutions.
Requirements
BS or MS in Electrical/Computer Engineering
10+ years of experience and working knowledge of Thermal/Mechanical stress analysis, test and/or optical design IC EDA tools and design methods including
o Thermal and/or mechanical stress analysis tools: Siemens (NX, Flotherm, Simcenter 3D, T3Ster), Ansys (Icepak, Mechanical), Cadence (Celsius)
Optical design/analysis tools: Siemens (Tanner), Ansys (Lumerical)Working experience in semiconductor package thermal management techniques, methods and best practices
Understanding of semiconductor package thermal and reliability requirements and test procedures
Prior experience in product management / product development / NPI is a plus
Prior experience in technical marketing / sales is a plus
· Additional understanding of general Physical IC design and/or IC packaging tools and concepts is favorable, including:
o Place and Route solutions: Siemens (Aprisa, Nitro, Tanner), Synopsys (IC/3DIC/Custom Compiler), Cadence (SoC Encounter, Innovus, Virtuoso)
o Physical Verification: DRC, LVS, IR/EM analysis
o Integration and validation of Silicon-on-Chip (SOC) IP integration and validation
- Working knowledge of IC tools and design methods including:
o RTL Design/Verification, Logic Syntheses, LEC, STA analysis
o DFT integration and ATE test support a plus
- Working knowledge of Advanced Packaging EDA tools and design methods including:
o 2.5D and 3D solutions (Si Interposer, FOWLP Package and Interposer, Organic Package)
o Package Design Cadence (APD/SiP), Siemens (XSI/XPD)
o Signal/Power integrity analysis: Siemens (HyperLynx SI/PI), Ansys (Redhawk, Totem, Swave), Cadence (Sigrity, Clarity)
Detailed knowledge of EDA data formats (Verilog, LEF/DEF, GDS, OASIS, etc.).
Working OS knowledge of Windows and Linux
Scripting/Programming:Python, Tcl, Perl, or similar languages required; Tk based GUI development is a plus.
Working competency with Microsoft Word, Excel, and PowerPoint.
Why us?
Working at Siemens Software means flexibility - Choosing between working at home and the office at other times is the norm here. We offer great benefits and rewards, as you'd expect from a world leader in industrial software.
A collection of over 377,000 minds building the future, one day at a time in over 200 countries. We're dedicated to equality, and we welcome applications that reflect the diversity of the communities we work in. All employment decisions at Siemens are based on qualifications, merit, and business need. Bring your curiosity and creativity and help us shape tomorrow!
Siemens Software. Transform the Everyday
The salary range for this position is $145,700 to $262,300. The actual compensation offered is based on the successful candidate’s work location as well as additional factors, including job-related skills, experience, and relevant education/training. Siemens offers a variety of health and wellness benefits to employees. Details regarding our benefits can be found here: www.benefitsquickstart.com . In addition, this position is eligible for time off in accordance with Company policies, including paid sick leave, paid parental leave, PTO (for non-exempt employees) or non-accrued flexible vacation (for exempt employees).
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